Isidibanisi samandla siya kuba yi-miniaturized, sincinci, i-chip, i-composite, i-multi-functional, i-high-precision kunye nobomi obude. Kwaye kufuneka baphucule intsebenzo ebanzi yokumelana nobushushu, ukucocwa, ukutywinwa kunye nokumelana nokusingqongileyo.Isidibanisi samandla, isinxibelelanisi sebhetri, isinxibelelanisi soshishino, isinxibelelanisi esikhawulezayo, iplagi yokutshaja, IP67 isinxibelelanisi esingangeni manzi, isinxibelelanisi, isinxibelelanisi semoto singasetyenziswa kwiinkalo ezahlukeneyo ezifana nezixhobo zomatshini weCNC, iikeyboards kunye namanye amasimi, kunye nesixhobo se-elektroniki sesekethe ukuqhubela phambili indawo enye kwi-on / off yophuhliso lwe-encometer entsha. itekhnoloji yezinto eziphathekayo nayo enye yeemeko ezibalulekileyo zokukhuthaza umgangatho wobugcisa weplagi yombane kunye namacandelo e-socket.
Imfuno yentengiso yesiqhagamshelo samandla, isiqhagamshelo sebhetri, isidibanisi semizi-mveliso, isiqhagamshelo esikhawulezayo, iplagi yokutshaja, i-IP67 isidibanisi esingangeni manzi, isidibanisi kunye nesinxibelelanisi semoto sigcine ukukhula okukhawulezayo kwiminyaka yakutshanje. Ukuvela kobuchwepheshe obutsha kunye nezinto ezintsha kuye kwakhuthaza kakhulu umgangatho wokusetyenziswa kweshishini.Isidibanisi samandla sithande ukuba sincinci kunye nohlobo lwe-chip. Intshayelelo kaNabechuan imi ngolu hlobo lulandelayo:
Okokuqala, umthamo kunye nemilinganiselo yangaphandle iyancitshiswa kwaye inqunyulwe. Umzekelo, kukho i-2.5gb / s kunye ne-5.0gb / s izihlanganisi zamandla, izihlanganisi ze-fiber optic, izihlanganisi ze-broadband kunye neziqhagamshelo ze-pitch-pitch (isithuba yi-1.27mm, 1.0mm, 0.8mm, 0.5mm, 0.4mm kunye ne-0.3mm) kunye nomphakamo ongaphantsi njenge-1.5mm kwimarike ~ ~ 1.5mm
Okwesibini, itekhnoloji yokunxibelelana yoxinzelelo isetyenziswa kakhulu kwi-cylindrical slotted socket, i-elastic strand pin kunye ne-hyperboloid wire spring socket connector power socket power connector, ephucula kakhulu ukuthembeka kwekhonkco kunye nokuqinisekisa ukuthembeka okuphezulu kokuhanjiswa komqondiso.
Okwesithathu, itekhnoloji ye-semiconductor ye-chip iba yinto eqhubayo yophuhliso lwesinxibelelanisi kuwo onke amanqanaba onxibelelwano.Nge-0.5 mm yokupakisha isithuba se-chip, umzekelo, uphuhliso olukhawulezayo, ukuya kwi-0.25 mm isithuba sokwenza i-I level interconnect (yangaphakathi) izixhobo ze-IC kunye Ⅱ kwinqanaba lokudibanisa (izixhobo kunye nokudibanisa) kweepleyiti ezilikhulu kwiinombolo zesixhobo ngenani.
Okwesine kukuphuhliswa kobuchwepheshe bendibano ukusuka kwi-plug-in yokufakela iteknoloji (THT) ukuya kwi-teknoloji ye-surface Mount (SMT), kwaye emva koko kwi-microassembly technology (MPT). I-MEMS ngumthombo wamandla wokuphucula iteknoloji yesixhumi samandla kunye nokusebenza kweendleko.
Okwesihlanu, itekhnoloji yokuthelekisa iimfama yenza isidibanisi senze imveliso entsha yoqhagamshelo, oko kukuthi i-push-in power connector, esetyenziswa ikakhulu kuqhagamshelwano lwenqanaba lenkqubo. Inzuzo yayo enkulu kukuba ayifuni intambo, kulula ukuyifaka kunye nokuqhaqha, kulula ukuyibuyisela kwisiza, iyakhawuleza ukuyivala kwaye ivale, igudile kwaye izinzile ukwahlula, kwaye inokufumana iimpawu ezintle zefrikhwensi ephezulu.
Ixesha lokuposa: Oct-11-2019