Isidibanisi samandla siya kuba yi-miniaturized, sincinci, i-chip, i-composite, i-multi-functional, i-high-precision kunye nobomi obude.Kwaye kufuneka baphucule ukusebenza okubanzi kokumelana nobushushu, ukucocwa, ukutywinwa kunye nokumelana nokusingqongileyo.Isidibanisi samandla, isiqhagamshelo sebhetri, isiqhagamshelo seshishini, ikhonkco ekhawulezayo, iplagi yokutshaja, i-IP67 ikhonkco engenamanzi, ikhonkco, i-automobile connector ingasetyenziswa kwiinkalo ezahlukeneyo, ezifana. njengezixhobo zoomatshini be-CNC, ii-keyboards kunye namanye amasimi, kunye nesekethe yezixhobo zombane ukuqhubela phambili indawo yokutshintsha ezinye ezivuliweyo / zokucima, i-encoder ye-potentiometer njalo njalo.Ukongezelela, ukuphuhliswa kobuchwepheshe bezinto ezintsha kukwayenye yeemeko ezibalulekileyo zokukhuthaza inqanaba lobugcisa. yeplagi yombane kunye nezixhobo zesokhethi.
Imfuno yentengiso yesiqhagamshelo samandla, isiqhagamshelo sebhetri, isidibanisi semizi-mveliso, isiqhagamshelo esikhawulezayo, iplagi yokutshaja, i-IP67 isidibanisi esingangeni manzi, isidibanisi kunye nesinxibelelanisi semoto sigcine ukukhula okukhawulezayo kwiminyaka yakutshanje.Ukuvela kobuchwepheshe obutsha kunye nezinto ezintsha kuye kwakhuthaza kakhulu umgangatho wokusetyenziswa kweshishini.Isidibanisi samandla sithande ukuba sincinci kunye nohlobo lwe-chip.Intshayelelo kaNabechuan imi ngolu hlobo lulandelayo:
Okokuqala, umthamo kunye nemilinganiselo yangaphandle iyancitshiswa kwaye inqunyulwe.Umzekelo, kukho i-2.5gb / s kunye ne-5.0gb / s izihlanganisi zamandla, izihlanganisi ze-fiber optic, izihlanganisi ze-broadband kunye ne-fine-pitch connectors (isithuba yi-1.27mm, 1.0mm, 0.8mm, 0.5mm, 0.4mm kunye ne-0.3mm) kunye nobude obuphantsi njenge-1.0mm ~ 1.5mm kwimarike.
Okwesibini, itekhnoloji yokunxibelelana yoxinzelelo isetyenziswa kakhulu kwi-cylindrical slotted socket, i-elastic strand pin kunye ne-hyperboloid wire spring socket connector power socket power connector, ephucula kakhulu ukuthembeka kwekhonkco kunye nokuqinisekisa ukuthembeka okuphezulu kokuhanjiswa komqondiso.
Okwesithathu, itekhnoloji ye-semiconductor ye-chip iya kuba yinto eqhuba uphuhliso lwekhonkco kuwo onke amanqanaba oqhagamshelwano. Nge-0.5 mm yokupakisha i-chip, umzekelo, uphuhliso olukhawulezayo, ukuya kwi-0.25 mm isithuba ukwenza i-I level interconnect (yangaphakathi) izixhobo ze-IC kunye Ⅱ inqanaba loqhagamshelwano (izixhobo kunye noqhakamshelwano) lwepleyiti kwinani lezikhonkwane zesixhobo ngemigca ukuya kumakhulu amawaka.
Okwesine kukuphuhliswa kobuchwepheshe bendibano ukusuka kwi-plug-in yokufakela iteknoloji (THT) ukuya kwi-teknoloji ye-surface Mount (SMT), kwaye emva koko kwi-microassembly technology (MPT).I-MEMS ngumthombo wamandla wokuphucula iteknoloji yesixhumi samandla kunye nokusebenza kweendleko.
Okwesihlanu, itekhnoloji yokuthelekisa iimfama yenza isidibanisi senze imveliso entsha yoqhagamshelo, oko kukuthi i-push-in power connector, esetyenziswa ikakhulu kuqhagamshelwano lwenqanaba lenkqubo.Inzuzo yayo enkulu kukuba ayifuni intambo, kulula ukuyifaka kunye nokuqhaqha, kulula ukuyibuyisela kwindawo, iyakhawuleza ukuyivala kwaye ivale, igudile kwaye izinzile ukwahlula, kwaye inokufumana i-frequency ephezulu. iimpawu.
Ixesha lokuposa: Oct-11-2019