Sicinga ukuba ezi teknoloji zilandelayo zinomdla kwindawo yokudibanisa
1. Akukho kudityaniswa kobuchwephesha bokukhusela kunye neteknoloji yokukhusela yendabuko.
2. Ukusetyenziswa kwezinto ezihambelana nokusingqongileyo kuhambelana nomgangatho we-RoHS kwaye kuya kuba phantsi kwemigangatho engqongqo yokusingqongileyo kwixesha elizayo.
3. Ukuphuhliswa kwezinto zokubumba kunye ne-molds.Ixesha elizayo kukuphuhlisa i-flexible adjustment mold, ukulungiswa okulula kunokuvelisa iimveliso ezahlukeneyo.
Iziqhagamshelo zigubungela uluhlu olubanzi lwamashishini, kubandakanya i-aerospace, amandla, i-microelectronics, unxibelelwano, i-electronics yabathengi, i-automotive, unyango, i-instrumentation, njalo njalo. Kwishishini lonxibelelwano, indlela yophuhliso lweziqhagamshelo yi-crosstalk ephantsi, i-impedance ephantsi, isantya esiphezulu, ukuxinana okuphezulu, ukulibaziseka kwe-zero, njl. imveliso yokuvelisa, uphando kunye nophuhliso ngaphezu kwe-10 Gbps ibeka phambili iimfuno eziphezulu ze-connector.Okwesithathu, ubuninzi bekhonkco eliqhelekileyo langoku li-63 imiqondiso eyahlukeneyo nge-intshi nganye kwaye ngokukhawuleza iya kuphuhlisa i-70 okanye i-80 yeempawu ezihlukeneyo nge-inch.Crosstalk ikhulile ukusuka kwi-5 ekhulwini ukuya ngaphantsi kwe-2 ekhulwini. olu hlobo lwesinxibelelanisi, owona mceli mngeni mkhulu wobugcisa okwangoku kuthumelo lwesantya esiphezulu kunye nokuqinisekisa unxibelelwano olusezantsi kakhulu.
Kwi-electronics yabathengi, njengoko oomatshini bebancinci, imfuno yokudibanisa iyancipha.Imarike ye-FPC yokudibanisa isithuba se-FPC yi-0.3 okanye i-0.5 mm, kodwa ngo-2008 kuya kuba ne-0.2 mm imveliso yesithuba.
Ixesha lokuposa: Apr-20-2019